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11V9 100*35*31.75*3*10mm D91 Resin Bond Diamond Grinding Wheel

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11V9 100*35*31.75*3*10mm D91 Resin Bond Diamond Grinding Wheel

Brand Name : JC

Model Number : 11V9

Certification : ISO

Place of Origin : Henan, China

MOQ : 5 pieces

Price : Negotiable

Payment Terms : T/T, D/A, D/P, Western Union,Paypal

Supply Ability : 10,000 /month

Delivery Time : 5-8 work days

Packaging Details : 1 pcs in one Paper Box

Shape : Cup

Usage : Grinding

Bond Agent : Resin

Delivery : By express

Package : Carton Box

HS Code : 6804211000

Abrasives : Diamond

Application : Cemented Carbide

Diameter : 100mm

Thickness : 35mm

Inner hole : 31.75mm

Abrasive width : 3mm

Granularity : D91

Abrasive depth : 10mm

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11V9 Resin Bond Doamond Grinding Wheel Product Description


Product Name: Resin Bond Diamond Grinding Wheel


Product Overview:

Resin diamond grinding wheel is a high-performance grinding tool with resin as the binder and diamond abrasive as the cutting body. It combines the ultra-high hardness of diamond and the flexibility of resin binder, and is suitable for high-precision and high-efficiency processing of hard and brittle materials such as ceramics, glass, semiconductors, and cemented carbide.

Product Features:

High grinding efficiency: Diamond has an extremely high hardness (Mohs hardness 10), which can quickly remove hard and brittle materials.

Good self-sharpening: Resin binders wear moderately, which can continuously expose new abrasive grains and maintain sharpness.

Low grinding temperature: Resin has poor thermal conductivity, but thermal damage can be reduced through pores or coolant.

High surface quality: Suitable for precision machining, reducing chipping or cracks on the workpiece.

Lightweight design: Resin has low density and is suitable for high-speed grinding.

Product size(mm):

Diameter(D) Thickness(T) Inner hole(H) Abrasive width(W) Abrasive depth(X) Granularity
100 35 31.75 3 10 D91

Of course if you need other sizes , we can customize for you.

Application:

Cemented carbide: sharpening and polishing of cutting tools and molds.

Ceramics/glass: precision processing of mobile phone covers and optical lenses.

Semiconductor materials: cutting and grinding of silicon wafers and silicon carbide wafers.

Stone processing: shaping and polishing of marble and granite.

Packaging and Shipping:

Each CBN grinding wheel is carefully packed in a sealed bag and wrapped with bubble film to prevent scratches or damage during transportation. After packaging, it is placed in a carton and sealed securely with tape. All orders are shipped via reliable couriers. After the order is shipped, we will provide customers with tracking information and estimated delivery time.

Competitive Advantages

1.We offer high quality products at competitive price.
2. Shortest delivery time.
3. Flexible payment terms.
4. Timely after-sale service.
5. Most of our equipment can be replaceable with international brands.
6. Our products have been exported to Argentina, Egypt, US, Australia, Romania, Pakistan, Dubai, Abu Dhabi, Iran, India,
Indonesia, Vietnam, Malaysia and many other countries.

Looking forward to your inquiry!


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Resin Bond Diamond Grinding Wheel

      
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